Effect of Multiple Reflow Cycles and Isothermal Aging on Shear Strength in SAC305/Sn58Bi/Cu-OSP Hybrid Solder Joint
Year: 2024
Type: article
Abstract: This study investigates the effects of multiple reflow cycles and isothermal aging on the shear strength and microstructure of SAC305/Sn58Bi/Cu-OSP hybrid solder joints. The joints combine SAC305 solder spheres and Sn58Bi solder paste reflowed on Cu-OSP substrates. Microstructural analysis revealed two distinct regions: a Bi-rich phase at the bottom and an Ag-rich phase at the top. Reflow cycles and isothermal aging at 85 °C, 125 °C, and 150 °C for up to 120 hours were evaluated for their impact on mechanical performance and reliability. Shear tests at 100 mm/s and 2000 mm/s showed that hybrid joints outperformed conventional SAC305/Cu-OSP joints, even after multiple reflow cycles. Aging at 85 °C and 125 °C had minimal impact on shear strength, indicating good stability under moderate conditions. However, aging at 150 °C, above the melting point of Sn58Bi (138 °C), caused a significant decrease in strength. These findings highlight the potential of hybrid solder joints for improved mechanical performance and thermal stability, offering advantages over conventional solder joints for advanced electronic packaging.
Authors: Muhammad Luqman Mokhtar, Flora Somidin, Mohd Arif Anuar Mohd Salleh
Institution: Universiti Malaysia Perlis
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
Funder: Nihon Superior
OpenAlex ID: W4405825495