Work

High-Performance Biobased Electronic Packaging Coatings Enabled by Unlocking the Photo-Cross-Linking Capacity of Lignin-Derived Epoxy Resin

Year: 2024

Type: article

Source: ACS Applied Polymer Materials

DOI: 10.1021/acsapm.4c03420

Authors: Keyu Lian, Shengdu Yang, Dianheng Lu, Wei Tang, Junhua Zhang

Institutions: Sichuan University, State Key Laboratory of Polymer Materials Engineering

Language: English

Topic: Epoxy Resin Curing Processes

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405834781

FWCI: 2.438

Cites: 55

Cited by: 18

Related to: 10