Work

Fabrication of Capacitive Micromachined Ultrasonic Transducers With High-k Insulation Layer Using Silicon Fusion Bonding

Year: 2024

Type: article

Source: Journal of Microelectromechanical Systems

DOI: 10.1109/jmems.2024.3516955

Authors: Sangho Bang, Chaerin Oh, Sang-Mok Lee, Subeen Kim, Taemin Lee, Seunghyeon Nam, Joontaek Jung, Hyunjoo Jenny Lee

Institutions: Korea Advanced Institute of Science and Technology, National NanoFab Center

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Samsung

OpenAlex ID: W4405844582

FWCI: 0.52

Cites: 37

Cited by: 5

Related to: 10