Work

Research on the Effect of Ultrasonic on the Interfacial Reliability of Micro Copper Pillar Solder Joints

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3523295

Authors: Jiameng Zhang, Qiang Zhang, Mengtao Xiao, Junhui Li

Institution: Central South University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G981922341

OpenAlex ID: W4405844873

FWCI: 0.104

Cites: 15

Cited by: 1

Related to: 10