Work

A flexible multi-standard I/O interface for chip-to-chip links in 65 nm CMOS

Year: 2024

Type: conference-paper

Source: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)

DOI: 10.1109/apccas62602.2024.10808294

Authors: Joscha Ilmberger, Niels Fiedler, Andreas Grübl, Johannes Schemmel

Institution: Heidelberg University

Language: English

Topic: Low-power high-performance VLSI design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: HORIZON EUROPE Framework Programme

OpenAlex ID: W4405845315

FWCI:

Cites: 12

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Related to: 10