Work

An On-chip High-resolution Delay Measurement Scheme for TSVs in 3DIC

Year: 2024

Type: conference-paper

Source: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)

DOI: 10.1109/apccas62602.2024.10808969

Authors: Dong-Yi Chen, Cheng-Hong Lee, Kuen-Jong Lee, Nan-Hsin Tseng, Hsin-Wei Hung, Hao-Yu Yang

Institutions: National Cheng Kung University, Taiwan Semiconductor Manufacturing Company (Taiwan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405845649

FWCI: 1.612

Cites: 11

Cited by: 2

Related to: 10