Work

Flip Chip Packaging for Superconducting Qubit: Design Methodology and Simulation

Year: 2024

Type: conference-paper

Source: International Symposium on Computer Engineering and Intelligent Communications (ISCEIC)

DOI: 10.1109/isceic63613.2024.10810189

Author: Wenzhao Li

Institution: Shanghai Jiao Tong University

Language: English

Topic: Quantum Information and Cryptography

Subfield: Artificial Intelligence

Field: Computer Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405845780

FWCI:

Cites: 12

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Related to: 10