Work

Thermoelectric Behavior Simulation in Electronic Systems

Year: 2024

Type: conference-paper

Source: IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

DOI: 10.1109/siitme63973.2024.10814911

Authors: Alin Grama, Alexandra Fodor, Cristina Davidas, Elena Mirela Stetco

Institution: Technical University of Cluj-Napoca

Language: English

Topic: Experimental Learning in Engineering

Subfield: Media Technology

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405907443

FWCI:

Cites: 8

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Related to: 10