Work

Interconnect Reliability Analysis of MCM Based on Different Application Environments

Year: 2024

Type: conference-paper

Source: Cross Strait Radio Science and Wireless Technology Conference (CSRSWTC)

DOI: 10.1109/csrswtc64338.2024.10811615

Authors: Qian Lin, Bo-Hao Zhang, Hai-Feng Wu

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405907540

FWCI:

Cites: 13

Cited by:

Related to: 10