Work

Stand for testing the lifetime of an automotive electronic module

Year: 2024

Type: conference-paper

Source: IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

DOI: 10.1109/siitme63973.2024.10814791

Authors: Teodor-Andrei Vilceanu, Septimiu Lica, Ioan Lie

Institution: Politehnica University of Timisoara

Language: English

Topic: Engineering and Test Systems

Subfield: Control and Systems Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405907563

FWCI: 0.72

Cites: 2

Cited by: 1

Related to: 10