Work

Technologies of Interconnections in Electronics – Signal and Power Integrity Student Contest

Year: 2024

Type: conference-paper

Source: IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

DOI: 10.1109/siitme63973.2024.10814761

Authors: M. Daraban, M. Manofu, R. Voina

Institution: Technical University of Cluj-Napoca

Language: English

Topic: Engineering Education and Pedagogy

Subfield: Architecture

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405907572

FWCI: 2.025

Cites: 2

Cited by: 1

Related to: 10