Work

TIE T+- Thermal Management Student Contest

Year: 2024

Type: conference-paper

Source: IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

DOI: 10.1109/siitme63973.2024.10814814

Authors: Alexandru-Gabriel Mihal, Cristina Mihaela Drăgan, Marcel Manofu

Institution: Politehnica University of Timisoara

Language: English

Topic: Engineering Education and Pedagogy

Subfield: Architecture

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405907683

FWCI: 2.025

Cites: 2

Cited by: 1

Related to: 10