Work

Understanding Electrochemical Migration Behavior in Fe2O3-Enhanced SAC Lead-Free Alloys

Year: 2024

Type: conference-paper

Source: IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

DOI: 10.1109/siitme63973.2024.10814913

Authors: Ali Gharaibeh, Ali Dayoub, Bálint Medgyes

Institution: Budapest University of Technology and Economics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405907749

FWCI: 2.34

Cites: 36

Cited by: 3

Related to: 10