Work

Considerations regarding environmental testing of a solderless assembly for electronics module

Year: 2024

Type: conference-paper

Source: IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

DOI: 10.1109/siitme63973.2024.10814738

Authors: Gaudentiu Varzaru, Roxana Tulea, Bogdan Mihailescu, Mihai Branzei, Paul Svasta

Institution: Universitatea Națională de Știință și Tehnologie Politehnica București

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405907780

FWCI: 0.781

Cites: 18

Cited by: 1

Related to: 10