Work

TIE Micro – Chiplets and Next-gen Packaging

Year: 2024

Type: conference-paper

Source: IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

DOI: 10.1109/siitme63973.2024.10814902

Authors: Cătălin Bogdan Ciobanu, Dan Manolescu, Roxana Vlăduţă, Luciana Chiţu, Cosmin Moisă, Marcel Manofu, Paul Svasta

Institutions: Transylvania University of Brașov, Universitatea Națională de Știință și Tehnologie Politehnica București, Politehnica University of Timisoara

Language: English

Topic: Engineering Education and Pedagogy

Subfield: Architecture

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405907799

FWCI:

Cites: 14

Cited by:

Related to: 10