Work

New Evaluation for Thermal Diffusivity of High-Power Devices with Different Packages

Year: 2024

Type: conference-paper

Source: IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

DOI: 10.1109/siitme63973.2024.10814849

Authors: Corina Ruxandra Mitulescu, Norocel Codreanu, Marius Mares, Bogdan Mihailescu, Paul Svasta

Institution: Universitatea Națională de Știință și Tehnologie Politehnica București

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405908100

FWCI:

Cites: 6

Cited by:

Related to: 10