Work

Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heating

Year: 2024

Type: conference-paper

Source: IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME)

DOI: 10.1109/siitme63973.2024.10814758

Authors: Irina Wodak, Attila Géczy, Oliver Krammer, Golta Khatibi, Andriy Yakymovych, Farzad Khodabakhshi, Zoltán Tafferner

Institutions: TU Wien, Budapest University of Technology and Economics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Austrian Science Fund

OpenAlex ID: W4405908129

FWCI: 1.612

Cites: 7

Cited by: 2

Related to: 10