Work

Validating Junction Temperature Estimation of Power Modules using Generative AI and Fiber Optic Sensing

Year: 2024

Type: conference-paper

Source: IEEE Design Methodologies Conference (DMC)

DOI: 10.1109/dmc62632.2024.10812134

Authors: Varaha Satya Bharath Kurukuru, Kaushik Mirdoddi, Roberto Petrella, Md Nazmul Hasan, Christian Mentin

Institution: Silicon Austria Labs (Austria)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

Funder: Electronic Components and Systems for European Leadership

Award: G7024222466

OpenAlex ID: W4405908299

FWCI: 0.78

Cites: 21

Cited by: 1

Related to: 10