Work

Inverse Order Packaging (invPack): Power Module Packaging Technique using Standard Fabrication Processes and Achieving Improved Performance at Lower Cost

Year: 2024

Type: conference-paper

Source: IEEE Design Methodologies Conference (DMC)

DOI: 10.1109/dmc62632.2024.10812160

Authors: Ioannis Almpanis, Paul Evans, Asad Fayyaz, Philippe Lasserre, Munaf Rahimo, Massimo De Giorgio, Iulian Nistor, Neophytos Lophitis

Institutions: University of Nottingham, Cyprus University of Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Engineering and Physical Sciences Research Council

Award: G7525711587

OpenAlex ID: W4405909014

FWCI:

Cites: 6

Cited by:

Related to: 10