Work

Disaggregated Designs: Technology Challenges and Enablers

Year: 2024

Type: article

Source: IEEE Micro

DOI: 10.1109/mm.2024.3524130

Authors: Boyd Phelps, Arif Khan

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405934941

FWCI: 0.312

Cites: 1

Cited by: 3

Related to: 10