Work

Thermal Reliability Simulation Analysis of Planar Microsystem

Year: 2024

Type: conference-paper

Source: International Conference on Integrated Circuits and Microsystems (ICICM)

DOI: 10.1109/icicm63644.2024.10814457

Authors: Shikai Sun, Lei Chen, Zhenlin Lu, Xuan Zhao, Lili Liu, Yongzheng Ren

Institutions: Peking University, Beijing Microelectronics Technology Institute

Language: English

Topic: Advanced MEMS and NEMS Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405935519

FWCI:

Cites: 10

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Related to: 10