Work

A Millimeter Wave Chip Package Designed by Mode Suppressing High Impedance Surface

Year: 2024

Type: conference-paper

Source: IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI: 10.1109/mape62875.2024.10813798

Authors: Weidong Kong, Jihu Li, Peng Lin, Shixiong Deng, Qiaonan Wang, Yue Zhang, Kuang Zhang, Guohui Yang

Institutions: Hebei Semiconductor Research Institute, Harbin Institute of Technology

Language: English

Topic: Microwave Engineering and Waveguides

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4405935785

FWCI:

Cites: 5

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Related to: 10