Work

8-inch Wafer Level Through Glass Via (TGV) Interposer with 110-GHz Bandwidth Facing 128-GBaud 2.5D Co-Packaged Optics (CPO)

Year: 2024

Type: conference-paper

DOI: 10.1109/acp/ipoc63121.2024.10809725

Authors: Chang Ge, Xinyi Wang, Jiangbing Du, Xiaozhong Lin, Ting Lei, Luping Du, Zuyuan He

Institutions: Shanghai Jiao Tong University, State Key Laboratory of Advanced Optical Communication Systems and Networks, State Key Laboratory of Advanced Optical Communication Systems and Networks, Shenzhen University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Shanghai Jiao Tong University, National Key Research and Development Program of China

Awards: G6324420094, G8647536437

OpenAlex ID: W4405935924

FWCI: 0.781

Cites: 7

Cited by: 1

Related to: 10