Work

A High-reliability Au Stud Bump Bonding Strategy Based on Au Pads for Flip-chip Bonding Applications

Year: 2024

Type: conference-paper

Source: International Conference on Integrated Circuits and Microsystems (ICICM)

DOI: 10.1109/icicm63644.2024.10814531

Authors: Shimeng Yan, Liyang Zhao, Zhiyi Song, Ruixin Li, Yigang Hao, Ziyue Zhang

Institutions: Beijing Institute of Technology, Beijing Microelectronics Technology Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China

Awards: G1207723674, G8344345082

OpenAlex ID: W4405936115

FWCI: 3.224

Cites: 12

Cited by: 4

Related to: 10