A Lightweight, Real-Time Die-to-Die Interface Protocol and Associated Adapter
Year: 2024
Type: conference-paper
Authors: Sihai Qiu, Yafei Liu, Wenyao Chen, Xiangyu Li
Institutions: Tsinghua University, Shanghai Jiao Tong University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4405936855