Work

2.5D Interposer HBM Signal Integrity Analysis Based on Fast MoM

Year: 2024

Type: conference-paper

Source: International Conference on Integrated Circuits and Microsystems (ICICM)

DOI: 10.1109/icicm63644.2024.10814142

Authors: Wenliang Dai, Ping Liu, Liguo Jiang

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405937025

FWCI: 0.781

Cites: 8

Cited by: 1

Related to: 10