Work

Package Design and Reliability Verification of Spaceborne SiP

Year: 2024

Type: conference-paper

Source: International Conference on Integrated Circuits and Microsystems (ICICM)

DOI: 10.1109/icicm63644.2024.10814444

Authors: Zheng Yang, Jiemei Liang, Shenglong Li, Yingke Gao

Institutions: China Academy of Space Technology, Beijing Institute of Control Engineering

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4405937051

FWCI:

Cites: 6

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Related to: 10