Work

Digital Chip Susceptibility Assessment and Level Classification via the DPI Approach

Year: 2024

Type: conference-paper

Source: IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications

DOI: 10.1109/mape62875.2024.10813884

Authors: Xing Siyi, Yan Zhaowen, Gao Tengfei, Chen Ying, Li Xingyu, Fu Changshun

Institution: Beihang University

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G1347977995

OpenAlex ID: W4405937500

FWCI: 1.612

Cites: 7

Cited by: 2

Related to: 10