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Die Thickness - a Neglected Design Parameter
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Year:
2024
Type:
conference-paper
DOI:
10.1109/imas61316.2024.10818057
Authors:
Bo E. Lindstrom,
William B. Kuhn,
Don M. Gruenbacher
Language:
English
Topic:
Electromagnetic Compatibility and Noise Suppression
Subfield:
Electrical and Electronic Engineering
Field:
Engineering
Domain:
Physical Sciences
Open Access status:
closed
OpenAlex ID:
W4405975375
FWCI:
Cites:
15
Cited by:
Related to:
10