Work

Research on quality assurance technology for electronic assembly process

Year: 2025

Type: conference-paper

Source: IET conference proceedings.

DOI: 10.1049/icp.2024.3682

Author: Chaohui Hu

Institution: China Electronic Product Reliability and Environmental Test Institute

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4406155547

FWCI:

Cites:

Cited by:

Related to: 10