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Fatigue life prediction of Dual Flat No-Lead packaging component solder joint

Year: 2025

Type: conference-paper

Source: IET conference proceedings.

DOI: 10.1049/icp.2024.3712

Authors: Bo Ye, Jun Wu, Chenghao Zhang

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4406171690

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