Research on the mechanism of a high robustness pressure sensor based on heat conduction
Year: 2025
Type: conference-paper
Source: IET conference proceedings.
Authors: Yonghao Zhang, Linhua Piao, Jiahao Sun
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4406182302
