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The application of failure analysis technology in the development of new quality productive forces in high-density chip level packaging industry

Year: 2025

Type: conference-paper

Source: IET conference proceedings.

DOI: 10.1049/icp.2024.3701

Authors: Yuezhen Huang, Zhimao Ming, Wei Zhao, Yangyong He

Institution: Guangzhou Electronic Technology (China)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4406198699

FWCI:

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