Thermal Design of GaN Power Devices in Wafer Level Chip Scale Package (WLCSP) for Automotive EPS Motor Drivers
Year: 2024
Type: conference-paper
Authors: Eojin Kim, Yeongo Kim, Eunwoo Kim, Hakmin Kim, Byeongyu Kim, Sewoong Ahn, Young-Jae Min
Institution: Halla University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G7266402578
OpenAlex ID: W4406264029