Work

Characterization of Thermal Behavior of Lead-Free SAC305 Solder for Optimal Manufacturing in Soldering Processes

Year: 2024

Type: conference-paper

Source: IEEE International Conference and Workshop Óbuda on Electrical and Power Engineering (CANDO-EPE)

DOI: 10.1109/cando-epe65072.2024.10772927

Authors: Béla Bődi, Viktor Gonda

Institution: Obuda University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4406265121

FWCI: 0.806

Cites:

Cited by: 1

Related to: 10