Incorporating negative thermal expansion Cu2V2O7 into epoxy to achieve low thermal expansion and high thermal conductivity
Year: 2025
Type: article
Source: Journal of Alloys and Compounds
Authors: Junqi Li, Feiyu Qin, Yiping Lv, Xin Yang, Tianhang Wu, Xiaoling Wang, Wenhui Xu, Nianjie Liu, Jun Wang, Lei Hu, Jun Sun, Xiangdong Ding
Institutions: Xi'an Jiaotong University, Fudan University
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W4406268886