Twin spacing manipulation of (111)-oriented nanotwinned copper via aeration flow control in a high-speed direct-current electroplating system with thiol organic additives
Year: 2025
Type: article
Abstract: It is a challenge to develop a cost-effective and time-efficient process for manufacturing nanotwinned copper foil with the precise control of twin spacing, a crucial determinant of nanotwinned copper properties.
Source: Journal of Materials Chemistry A
DOI: 10.1039/d4ta07905a
Authors: Hsiang-Sheng Wei, Kuan-Ling Liu, Hsu Tsou, Hao-Yu Ku, Chi-Chang Hu
Institution: National Tsing Hua University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W4406286754
