Work

“Ship Lock” Thermal Design of Power Chip Packaging and Its Effects on Thermal Performance and Reliability Based on Dimensional Parameters

Year: 2024

Type: conference-paper

DOI: 10.1109/sslchinaifws64644.2024.10835346

Authors: Baorong Su, Miao Cai, Daoguo Yang

Institution: Guilin University of Electronic Technology

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Natural Science Foundation of Guangxi Province, Guilin University of Electronic Technology, Natural Science Foundation of Ningbo, Chongqing Graduate Student Research Innovation Project

Awards: G103440156, G5675162714, G8185980376, G893904084

OpenAlex ID: W4406459692

FWCI:

Cites: 4

Cited by:

Related to: 10