Work

Simulation Study of the Effect of Chip Warpage on the Bonding Process of Vertical Micro-LED Arrays

Year: 2024

Type: conference-paper

DOI: 10.1109/sslchinaifws64644.2024.10835334

Authors: Guoxu Fang, Haojie Zhou, Zhu Yang, Boyan Zhao, Min Wu, Xiaoxiao Ji, Luqiao Yin, Jianhua Zhang

Institution: Shanghai University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Key Research and Development Program of China

Award: G3121791300

OpenAlex ID: W4406459764

FWCI:

Cites: 11

Cited by:

Related to: 10