Simulation Study on Thermal Mechanical Properties of 3×3 Micro-LED Array in Bonding Process after Mass Transfer
Year: 2024
Type: conference-paper
Authors: Min Wu, Zhu Yang, Haojie Zhou, Boyan Zhao, Guoxu Fang, Xiaoxiao Ji, Luqiao Yin, Jianhua Zhang
Institution: Shanghai University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G3121791300
OpenAlex ID: W4406460104