Work

Exploring Pressureless Nano-Copper Sintering for Power Chip Interconnection

Year: 2024

Type: conference-paper

DOI: 10.1109/sslchinaifws64644.2024.10835358

Authors: Chenshan Gao, Shizhen Li, Shaogang Wang, Guoqi Zhang, Huaiyu Ye

Institutions: Southern University of Science and Technology, Delft University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: Applied Basic Research Foundation of Yunnan Province, Major Scientific and Technological Project of Zhejiang Province

Awards: G1896430653, G3339970303

OpenAlex ID: W4406460290

FWCI:

Cites: 10

Cited by:

Related to: 10