Thermodynamic Analysis of Multi-Stage Thermal Compression Bonding for Fabricating Vertically Stacked Micro-Led Array
Year: 2024
Type: conference-paper
Authors: Lianyu Wang, Kailin Ren, Luqiao Yin, Jianhua Zhang
Institution: Shanghai University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4406460293