Work

Research on High Thermal Conductivity Silver Sintering Interconnection Process and Heat Dissipation Performance of High-Power UV-LED Packaging Chips

Year: 2024

Type: conference-paper

DOI: 10.1109/sslchinaifws64644.2024.10835380

Authors: Yuxuan Guo, Miao Cai, Hao Chen, Daoguo Yang

Institution: Guilin University of Electronic Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G945369884

OpenAlex ID: W4406460316

FWCI:

Cites: 5

Cited by:

Related to: 10