Work

Finite Element Simulation of Electrothermal and Mechanical Coupling in Micro-LED Array Based on Two Bump Shapes

Year: 2024

Type: conference-paper

DOI: 10.1109/sslchinaifws64644.2024.10835379

Authors: Zhu Yang, Jianxin Li, Hao Fu, Haojie Zhou, Xiaoxiao Ji, Luqiao Yin, Xiuzhen Lu, Jianhua Zhang

Institution: Shanghai University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Key Research and Development Program of China

Award: G3121791300

OpenAlex ID: W4406460391

FWCI: 0.799

Cites: 13

Cited by: 1

Related to: 10