Fatigue Life Analysis of Hybrid Bonding in Micro-LED Interconnection
Year: 2024
Type: conference-paper
Authors: Xinhui Meng, Kefeng Wang, Hong Fan, Zhu Yang, Hao Fu, Luqiao Yin, Xiuzhen Lu, Jianhua Zhang
Institution: Shanghai University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4406460459