A Lightweight and Reliable Sideband Interface for Die-to-Die
Year: 2024
Type: conference-paper
Authors: Ruotong Zhao, Bofu Li, Zhiyi Guo, Xiangyu Li
Institution: Tsinghua University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4406523077