Work

An RF Signal Amplification and Power Detection 3D System-in-Package (SIP) Design Based on HDI Technology

Year: 2024

Type: conference-paper

Source: International Symposium on Antennas, Propagation and EM Theory (ISAPE)

DOI: 10.1109/isape62431.2024.10841128

Authors: Hansong Li, Mengxia Yu, Shunyu He

Institution: University of Electronic Science and Technology of China

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4406728529

FWCI:

Cites: 3

Cited by:

Related to: 10