Work

Comparison of the Electrical Properties of Copper Diffusion-Bonded Joints and Solder Joints for $\mathrm{(RE)Ba}_{2}\text{Cu}_{3}\mathrm{O}_{7-\delta }$ Tapes

Year: 2025

Type: article

Source: IEEE Transactions on Applied Superconductivity

DOI: 10.1109/tasc.2025.3530325

Authors: Gaël Berthet, Wonju Jung, Hyunsoo Park, Seungyong Hahn, Sangjin Lee

Institution: Seoul National University

Language: English

Topic: Superconducting Materials and Applications

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Ministry of Science and ICT, South Korea

Awards: G3507784712, G4977154379

OpenAlex ID: W4406793929

FWCI: 0.723

Cites: 20

Cited by: 3

Related to: 10