MOSAIC®: Chiplet Architecture Based on Die-to-Die Interface for CXL®Memory Applications and Limitations in Bandwidth, Latency, and Power
Year: 2024
Type: conference-paper
Authors: Minsoon Hwang, Joohyung Kim, Taeho Lim, Namhyun Yun, Ieryung Park, Keeyoung Kwon, Inhwa Jung, Dongsop Lee, Euicheol Lim
Institution: SK Hynix (South Korea)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4406894966