Year: 2025
Type: article
Abstract: Advanced packaging enabled chiplet architectures are increasingly adopted to drive performance and cost improvements. New heterogeneous architectures like 2.5D Fanout, 3D and 3.5D Hybrid bonded architectures driving AMD’s industry leading advanced technology roadmap will be shared. Other topics including chiplets for AI, challenges and solutions for large chiplet modules, etc. will also be discussed.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.128222
Author: Hemanth Dhavaleswarapu
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4406972131